Exploring the convergence of communication, sensing, AI, and advanced hardware integration across future wireless platforms.
I'm a wireless design engineer based in Irvine, California, leading RF front-end module development at Skyworks Solutions. My work sits at the intersection of semiconductor technology, RF systems, and advanced System-in-Package (SiP) integration — building the hardware that enables billions of wireless connections worldwide.
My experience spans RF front-end architectures, compound semiconductor technologies, advanced packaging, and high-volume product development for next-generation wireless platforms. As wireless systems evolve beyond traditional cellular networks, my interests increasingly focus on Integrated Sensing and Communication (ISAC), non-terrestrial networks (NTN), AI-enabled sensing, and the convergence of communication, perception, and intelligence.
I am particularly interested in how future wireless hardware will integrate communication, sensing, and machine learning into unified platforms that can both connect and understand the world around them.
Beyond industry, I serve as Chair of the IEEE Microwave Theory and Technology Society Orange County Chapter, contribute as a reviewer for IEEE Microwave and Wireless Technology Letters, and regularly speak about emerging trends in wireless systems, RF technologies, and advanced semiconductor integration.
Design of RF front-end modules for wireless devices — architecting the signal path between transceiver and antenna, integrating amplifiers, switches, and filters built on advanced compound semiconductor devices and ICs into modules that meet linearity, efficiency, and isolation targets in production. My core work.
Integrated sensing and communication: wireless networks that sense, detect, and locate using the same spectrum and hardware that carry data. My primary research interest.
System-in-Package design — co-locating dies, filters, and passives in one module, managing coupling, grounding, and thermals across the package.
Package size reduction through filter stacking and novel module architectures — the subject of my three pending patents.
Non-terrestrial networks: extending device front-ends to direct satellite links, where link budgets and sensitivity requirements get unforgiving.
The upper mid-band (7–24 GHz) being opened for 6G — new territory for front-end design where coverage, capacity, and sensing converge.
Led module design across 4 RF front-end module programs — 3 shipping in production and 1 in active development, together driving an estimated $400M+ in combined revenue. Owned the module from architecture and simulation through SiP integration, layout, and production bring-up.
Following the shift of connectivity beyond the cell tower — studying how direct satellite-to-device links reshape front-end design, from link budgets and sensitivity floors to new band coverage demands.
A research thread on sensing-aware front-end design for ISAC — wireless networks that detect and locate while they carry traffic. Bridging the modules I ship today and the perceptive systems coming next.